AD255C laminates combine the superior thermal properties of a fluoropolymer resin system with selected ceramic materials and fiberglass reinforcement to yield a RF laminate material with lower loss, lower thermal expansion properties and lower passive intermodulation (PIM). Stability of PTFE over wide frequency and temperature ranges, with low loss properties, makes AD255C laminates ideal for a variety of microwave and RF applications in telecommunication infrastructure.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| AD250C™ | AD255C™ | AD300D™ | AD350A™ | |
|---|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.50+/-0.04 | 2.55+/-0.04 | 2.97, 3.03 +/-0.05 | 3.50+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.52 | 2.60 | 2.94, 3.03 | 3.54 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0013 | 0.0013 | 0.0021 | 0.0033 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -117 | -110 | -73 | -57 |
| Volume Resistivity Mohm (Typical) | 4.8x108 | 7.4x108 | 1.7x108 | 1.5x109 |
| Surface Resistivity Mohm (Typical) | 4.1x107 | 3.6x107 | 5.1x107 | 9.5x107 |
| Water Absorption D48/50% (Typical) | 0.0422 | 0.0322 | 0.04 | 0.1022 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.33 | 0.35 | 0.37 | 0.44 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 47 | 34 | 24 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 29 | 26 | 23 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 196 | 196 | 98 | 63 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 14.8 (2.6) | 13.6 (2.4) | 18.3 (3.2) | 14.7 (2.6) |
| Density gm/cm3 (Typical) | 2.28 | 2.28 | 2.23 | 2.43 |
| Flammability Rating UL94 | V-0 | V-0 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y | Y | Y |
| PIM dBc Typical | -164 | -164 | -159 | -164 |
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