RO4400™/RO4400T™ Series Bondply

RO4000 dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ and RO4000 LoPro® glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant (Dk), or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.

Features

• Prepreg grades based on RO4000 series core materials
• Low z-axis coefficient of thermal expansion ranging from 43 to 60 ppm/°C
• Sequential lamination capable
• Lead free solder processing compatible

Benefits

• Compatible in multi-layer board constructions with RO4003C, RO4350B, RO4835™, RO4360G2™ or RO4000 LoPro laminates.
• CAF resistant
• High frequency thermoset prepreg compatible with FR-4 bond temperatures
• High reliability plated through-hole

Applications

View current applications of this product.

Backhaul Radios

Communications
Systems

Computing

IP Infrastructure

Power Amplifiers

Small Cells / DAS

Test & Measurement

• Backhaul Radios
• Communications
  Systems
• Computing
• IP Infrastructure
• Power Amplifiers
• Small Cells / DAS
• Test & Measurement