RO3003G2 laminate's combination of optimized resin and filler content provides a lower insertion loss, ideal for use in ADAS systems like adaptive cruise control, forward collision warning and active brake or lane change assist.

Features

  • Dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz
  • Very Low Profile (VLP) ED copper
  • Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity
  • Enhanced Filler System

Benefits

  • Best in class performance for insertion loss
  • Minimize dielectric constant variation in finished PCB
  • Enable trend toward more small diameter vias Global manufacturing foot print

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

RO3003G2™
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 3.00+/-0.04
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 3.07(29)
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0011
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -35
Volume Resistivity Mohm (Typical) 1.4x109
Surface Resistivity Mohm (Typical) 2.6x108
Water Absorption D48/50% (Typical) 0.06
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.43
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 16
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 17
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 18
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 12.0(30)
Density gm/cm3 (Typical) 2.15
Flammability Rating UL94 V-0
Lead-Free Process Compatible Y
PIM dBc Typical

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