RO4000 dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ and RO4000 LoPro® glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant (Dk), or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Bonding Material Properties Tool.
| RO4450F™ | RO4450T™ (0.003") | |
|---|---|---|
| Dielectric Constant 1, @10GHZ (2.5 GHz) Typical | 3.52+/-0.05 | 3.23+/-0.05 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) 1 (Typical) | 0.0040 | 0.0039 |
| Volume Resistivity Mohm × cm 2 (Typical) | 8.93x108 | 2.9x109 |
| Water Absorption D48/50% 3 (Typical) | 0.09 | 0.11 |
| Thermal Conductivity W/m/°K (Typical) 4 50°C ASTM D5470 | 0.65 | 0.50 |
| Coefficient of Thermal Expansion 0-100°C ppm/°C 5 (Typical) X | 19 | 20 |
| Coefficient of Thermal Expansion 0-100°C ppm/°C 5 (Typical) Y | 17 | 21 |
| Coefficient of Thermal Expansion 0-100°C ppm/°C 5 (Typical) Z | 50 | 57 |
| Density gm/cm3 (Typical) | 1.83 | 1.83 |
| Flammability Rating UL94 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y |
| Press Temperature | 175C (350F) | 175C (350F) |
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