RO4835 laminates are a low loss material that offer low cost circuit fabrication, compatible with standard epoxy/glass (FR-4) processes. These laminates are available with Rogers proprietary LoPro® Reverse treated copper foil, ideal for applications requiring low insertion loss.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RO4835™ | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.48+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.66 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0037 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | 50 |
| Volume Resistivity Mohm (Typical) | 5x108 |
| Surface Resistivity Mohm (Typical) | 7x108 |
| Water Absorption D48/50% (Typical) | 0.05 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.66 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 10 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 12 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 31 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 5.0 (0.88) |
| Density gm/cm3 (Typical) | 1.92 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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