Rogers' portfolio of prepregs and bondplys are designed for consistent reliability and performance for the most demanding multi-layer PWB applications. With electrical and mechanical properties exceptionally matched to our high frequency laminates, our wide-range selection of non-reinforced and glass reinforced bonding and adhesion materials provides designers options for a total Rogers solution. Additionally, Rogers' numerous families of bonding materials are developed on varying technologies, resulting in a range of solutions from the most challenging to traditional process ability methods.


  • Thickness range of 0.0015 to 0.005 in. 
  • Dissipation factor as low as 0.0009 at 10GHz, at 2.99 Dk
  • Available both with and without glass reinforcement


2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based thin film adhesive system.

CuClad® 6250 Bonding Film

  • Dk or 2.32
  • Ethylene-acrylic acid thermoplastic copolymer bonding film

CuClad® 6700 Bonding Film

  • Dk of 2.35
  • Chloro-trifluoroethylene (CTFE) thermoplastic copolymer bonding film

RO4400™/RO4400T™ Series Bondply

  • Prepreg family based on RO4000 series core materials.
  • Sequential lamination capable
  • Lead free soldering capable
  • Thinner options for improved multilayer design flexibility

SpeedWave® 300P Prepreg

SpeedWave® 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates


COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

XtremeSpeed™ RO1200™ Series 

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.


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