Our curamik Power substrates are comprised of Al2O3 Direct Bond Copper (DBC), offering the industry’s best price-performance ratio. Al2O3 DBC substrates are offered in many thickness combinations to suit specific applications. This allows control of thermal resistance, which is determined by the heat conductivity and thickness of the ceramics used in the substrate. Our curamik Power substrates can be used in applications with low and medium power output, such as general power electronics, concentrated photovoltaics (CPV), Peltier elements and semiconductor modules for automotive applications.


  • Offers thermal conductivity of 24 W/mK @ 20°C
  • Available in many thickness combinations
  • CTE of 6.8 ppm/K @ 20°C - 300°C


  • Offers sufficient thermal and mechanical properties for the most common applications
  • Has the capability to carry high electrical currents and high ampacity
  • Provides performance and reliability for the life of the product



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