Each year, Americans commemorate National Hispanic Heritage Month from September 15 to October 15.
As LED types changed from a T-Pack to Chip on Board packaging technology and an overall reduction in size, the number of LEDs per array tremendously increased. This results in a higher heat density and heat load which increases the challenges in cooling the package.
This year, with the future of our business and planet in mind, we released our first ever Environmental, Social and Governance (ESG) Report.
This is the second blog of a two-part series which addresses considerations that can be important to understand for a RF designer, when transitioning from designs at lower frequency to designs at much higher frequencies, millimeter-wave frequencies.
A new Si3N4 raw ceramic material is now available, and Rogers will leverage its strong partner network to deliver large-scale production of higher performing Si3N4 AMB substrates.
During the past years, electric automobiles have evolved from conceptual prototypes to a booming trend, overcoming great challenges on the way and occupying a growing portion of the automotive market. E-aircrafts are now in the concept phase, getting ready to take off.
This blog is part one of a two-part series which addresses the transition for RF design considerations at lower frequencies to design considerations at mmWave frequencies, from a basic RF design perspective.
The mental wellbeing of our employees is a top priority at Rogers Corporation. We proudly offer Employee Assistance Resources, which include resources for well-being, family, career, lifestyle, legal and financial support.
Substrates are not only available in multiple copper and ceramic thicknesses, but also various design options and product features exist to fit the specific customers’ needs. In this blog, we take a closer look at these features.
As millimeter-wave technologies continue to advance in the printed circuit board (PCB) industry, there are emerging needs for more diverse circuit constructions. A previous limiting factor for complex millimeter-wave PCB constructions, had been appropriate bonding materials to accommodate the circuit fabrication as well as the demanding RF performance at these high frequencies. These issues have been addressed in the following blog.
In 2004, and even some time before the global PC gaming boom started, curamik® engineers from the field of high power laser cooler applications came up with the idea to use our unique Direct Bonded Copper (DBC) technology and developed special micro channel cold plates for CPU cooling.
Silicon carbide (SiC) has outstanding properties which makes it a very useful material for power semiconductor devices in multiple applications, such as renewable energy systems and inverters for electric vehicles. However, the specific costs ($/cm²) of SiC devices are and will remain higher than silicon (Si) devices, though the cost ratio may change in the future.
Yesterday, NASA announced yet another historic moment on Mars: the landing of their most advanced explorer yet, the Perseverance Rover. After a 6-1/2 month long journey from Florida, the rover successfully touched down at the Jezero Crater at 3:55 pm EST.
The year 2020 proved to be challenging in many ways. In response, Rogers employees have demonstrated an inspiring amount of resilience and commitment. This remained true during the holiday season, a time often dedicated to creating joy and giving to others.
Stray inductance of switching circuits is one of the most critical parameters in the design of power electronics and is becoming even more important for systems using wide-bandgap semiconductors, such as SiC and GaN.