In our first blog in this series, we explored thermal conductivity and its measurement techniques and explained why your thermal interface material may not be as conductive as you think if you are relying on vendor data sheets. In this blog, we’ll take a closer look at two other measures used in evaluating thermal interface materials (TIM).
If you’re an electronics designer or assembler addressing thermal management issues, safety is likely your number one concern. When selecting a thermal interface material (TIM) to dissipate heat, you probably started by comparing the thermal conductivity (K) of your options. But did you know that manufacturers’ advertised values of thermal conductivity can be widely inaccurate?
In a word (or three), not so much. Our customers are often surprised to learn that all PORON® Comfort materials are open cell polyurethane foams, especially when what they’re used to seeing are closed cell EVA foams or closed cell polyurethane foams.
Power electronics is changing rapidly. New packaging technologies are facing a rise in chip temperatures as seen in such applications as EVs / HEVs. Electronics increasingly need longer lifetimes to function in harsh conditions, such as wind turbines.
Rogers Corporation announces an extension of the thickness range for AquaPro® 37™ – the material of choice for long-lasting protection of sensitive electronics and enclosed devices.