One Substrate, Multiple Options

Jun 11, 2021 | Olivier Mathieu, Market Development Manager

Substrates are not only available in multiple copper and ceramic thicknesses, but also various design options and product features exist to fit the specific customers’ needs. In this blog, we take a closer look at these features.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Inductance Optimization for Laminated Busbars

Jan 12, 2021 | Olivier Mathieu, Market Development Manager

Stray inductance of switching circuits is one of the most critical parameters in the design of power electronics and is becoming even more important for systems using wide-bandgap semiconductors, such as SiC and GaN.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial

Rogers Micro-Channel Coolers´ (MCC) Applications in Several Different Markets - Guess Which Ones

Dec 03, 2020 | Olivier Mathieu, Market Development Manager

About two decades ago, engineers in the field of laser technique were looking for a partner to design and build high power coldplates that could support their need for a cutting-edge cooling system targeted to their laser bars. Together with the curamik® engineering team the idea of bonded micro-channel-coolers was born.

Olivier's Twist Blog, General Industrial, Wired Infrastructure

Applications for Metallized Ceramic Substrates

Oct 19, 2020 | Olivier Mathieu, Market Development Manager

Among other measures, voltage, current and mission profile are critical parameters to consider in the selection of the substrate for a given application. In this blog, we look at common applications for multi-chip power modules to understand the rationale behind each technology.

Olivier's Twist Blog, General Industrial, Major Appliances, Rail, Wind & Solar

High Performance Busbars for e-Mobility

Sep 09, 2020 | Olivier Mathieu, Market Development Manager

The motor, battery and electrical control system are known as the tri-electric system of e-Mobility.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial

Determining the Thermal Conductivity of Thin Ceramics

Jul 28, 2020 | Olivier Mathieu, Market Development Manager

During the design phase of a power module, engineers select the components, materials and manufacturing technologies to fulfill the requirements regarding performance, reliability and costs set by their customers. Over-engineering can be desirable when safety, reliability and performance are critical.

Olivier's Twist Blog, General Industrial

Frequently Asked Power Electronics Questions

Jul 01, 2020 | Olivier Mathieu, Market Development Manager

In this edition we would like to answer a few frequently asked questions to benefit those new to the power electronics community and a refresher training for those experienced in the industry as well.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Optimal Interconnection for Prismatic Battery Systems in Electric Vehicles

Jun 16, 2020 | Olivier Mathieu, Market Development Manager

In a previous blog, we examined the current collector busbars for the cylindrical cell in electric vehicles. Many of the electrical, mechanical and thermal requirements are also applicable to prismatic cells. However, the manner in which a battery pack in the vehicle is designed depends on the OEM´s preference.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial

Influence of Copper Grain Size on Assembly Process and Substrate Performance

Apr 06, 2020 | Olivier Mathieu, Market Development Manager

The copper grain size is an important property of Direct Bonded Copper (DBC) substrates. Variations in the copper grain size cannot be fully excluded, but large variations may affect the subsequent assembly processes or the performance of DBC substrates. Module manufacturers can rely on the experience and competence of Rogers' Power Electronics Solutions team to deliver substrates with a consistent grain size.

Olivier's Twist Blog, Aerospace & Defense, General Industrial, Major Appliances, Rail, Wind & Solar

Optimal Interconnection for Cylindrical Battery Systems in Electric Vehicles

Mar 04, 2020 | Olivier Mathieu, Market Development Manager

Thermal management is a challenge that the correct busbar can assist with, especially for cylindrical cell connections where the busbar may connect hundreds of cells to make a complete module.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial

Metallized Ceramic Substrates for the New Decade

Jan 27, 2020 | Olivier Mathieu, Market Development Manager

Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates have been available for the last four decades. Together they have made a large contribution to the market adoption and penetration of power modules.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Considerations for the Design of DBC and AMB Substrates

Jan 09, 2020 | Olivier Mathieu, Market Development Manager

The beginning of a new year is a time for resolutions. It is also a perfect opportunity to discuss key principles to design custom Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Wind & Solar

ROLINX CapLink Solutions: 1+1 > 2: Low inductance integrated capacitor and DC link busbar solution for e-Mobility

Dec 09, 2019 | Olivier Mathieu, Market Development Manager

Information on ROLINX CapLink solutions: a complete integration of a laminated busbar and discrete film capacitor.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar

Insulation Materials for Laminated Busbars - A discussion on flexible and rigid insulation films and their parameters (Interview with Sebastiaan De Boodt)

Nov 01, 2019 | Olivier Mathieu, Market Development Manager

In today's blog you will find an interview with Sebastiaan De Boodt, who works for Rogers Corporation.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar

curamik® Micro Channel Coolers

Oct 01, 2019 | Olivier Mathieu, Market Development Manager

Olivier Mathieu talks about the design, internal structure and thermal performance of our micro channel liquid coolers.

Olivier's Twist Blog, Aerospace & Defense, General Industrial, Wired Infrastructure

Back to the Pages of History

Sep 04, 2019 | Olivier Mathieu, Market Development Manager

In the last decade power electronics has gained importance with climate targets set to cut greenhouse gas emissions; therefore increasing renewable energy consumption. The new generation is aware of the environment and pollution challenges that our society is facing, motivating and attracting young engineers to study power electronics.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Copper Is Here to Stay in Power Electronics

Aug 01, 2019 | Olivier Mathieu, Market Development Manager

While silicon is the most common element used for power semiconductors, copper is the most popular choice for conductor traces on printed circuit boards (PCBs) and ceramic substrates due to its electrical conductivity.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail

Designing for Thermal Management

Jul 10, 2019 | Rogers Corporation

In our first blog in this series, we explored thermal conductivity and its measurement techniques and explained why your thermal interface material may not be as conductive as you think if you are relying on vendor data sheets. In this blog, we’ll take a closer look at two other measures used in evaluating thermal interface materials (TIM).

General Industrial, Thermal Management

Simulations That Help You

Jun 24, 2019 | Olivier Mathieu, Market Development Manager

Electronic systems rely on efficient combination and distribution of voltages and currents from different sources. In high-power applications, such as industrial drives, renewable energy inverters, powertrains for electric vehicles and converters used in rail, energy must be channeled with minimal power losses.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar, Wired Infrastructure

How does Gallium Nitride fit into the Next Generation of High Performance Electronics

May 25, 2019 | Olivier Mathieu, Market Development Manager

In a recent Olivier’s Twist blog, the topic of Silicon Carbide semiconductor materials was discussed for future high power efficiency applications. There is also another semiconductor technology that is filling a gap in performance between Silicon and Silicon Carbide, and that is Gallium Nitride.

Olivier's Twist Blog, General Industrial, Rail, Wind & Solar

Inductance, Partial Discharge and Other Critical Performances in Laminated Busbars

Apr 29, 2019 | Dominik Pawlik, Market Development Manager

Dominik Pawlik explains the details about laminated busbars, the advantages and where the busbars are used.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar

There is a Packaging Problem to Solve for Silicon Carbide Devices

Mar 27, 2019 | Olivier Mathieu, Market Development Manager

There is currently a lot of interest for silicon carbide (SiC) as a semiconductor material because its properties make it more promising than silicon for power electronics applications.

Olivier's Twist Blog, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar, Wired Infrastructure

Why Your Thermal Interface Material May Not Be as Conductive as You Think: Exploring Thermal Conductivity & Measurement Techniques

Mar 14, 2019 | Rogers Corporation

If you’re an electronics designer or assembler addressing thermal management issues, safety is likely your number one concern. When selecting a thermal interface material (TIM) to dissipate heat, you probably started by comparing the thermal conductivity (K) of your options. But did you know that manufacturers’ advertised values of thermal conductivity can be widely inaccurate?

General Industrial, Thermal Management

Learn All About Laminated Busbars

Feb 28, 2019 | Dominik Pawlik, Market Development Manager

A Quick Introduction to ROLINX® Laminated Busbar Solutions, Dominik Pawlik explains the details about laminated busbars, the advantages and where the busbars are used.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Rail, Wind & Solar

Thermal Management: A Broad Overview of Cooling Techniques

Dec 01, 2018 | Olivier Mathieu, Market Development Manager

In the world of electronics, heat can severely shorten the lifetime of a device. It is therefore necessary to move heat away from vital components such as chips, LEDs, and inverters to maintain optimal performance without shortening the lifetime. There are many different thermal management techniques that can be utilized by engineers depending on the devices heat density, space constraints and cost.

Olivier's Twist Blog, Aerospace & Defense, General Industrial, Portable Electronics, Wired Infrastructure

Thermal Resistance Value in a Data Sheet Doesn’t Tell the Whole Story About Thermal Performance

Nov 01, 2018 |

A data sheet is the main source of information for design engineers to understand the overall performance of a power module. It provides a wide variety of values and diagrams but detailed background explanations on each parameter are often missing. On the other hand, a test set up cannot cover all possible applications or operating conditions and the values can vary according to the user's particular application.

Olivier's Twist Blog, Automotive & EV/HEV, Aerospace & Defense, General Industrial, Wind & Solar, Wired Infrastructure

Are you flattering me?

Aug 31, 2018 | Olivier Mathieu, Market Development Manager

Who cares about flatness? Process and application engineers do! These are not flattering words as they truly know how critical it is to understand and control the shape of one’s substrate, base plate and heat sink in order to achieve the best possible production yield and module performance. In this blog, I want to share with you some information about flatness that you may wish to consider as you design or use power modules.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Foam Properties: What Makes One Foam Different From Another?

Aug 21, 2018 | Dave Sherman

In a word (or three), not so much. Our customers are often surprised to learn that all PORON® Comfort materials are open cell polyurethane foams, especially when what they’re used to seeing are closed cell EVA foams or closed cell polyurethane foams.

Footwear, Impact Safety, General Industrial

Building Power Modules is not Magic but Requires High Quality Substrates

Jul 31, 2018 | Olivier Mathieu, Market Development Manager

Design engineers are selecting Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates as circuit material for bare semiconductor chips in their power modules as they efficiently dissipate the waste heat from the semiconductors and increase the lifetime of the modules. In this blog, we explain the production process for power modules and highlight the most important characteristics of the substrates at each step of this assembly process.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Get the Heat Out! Considerations for Dissipating Heat from your Semiconductor Device

Jun 01, 2018 | Olivier Mathieu, Market Development Manager

Thermal management is required to achieve optimal power electronic system performance and reliability. While in operation, power semiconductor devices generate a lot of waste heat as a result of conductive and switching losses. This heat has to be dissipated from the semiconductor junction to the semiconductor package and ultimately to the ambient environment to prevent thermal runaway.

Olivier's Twist Blog, General Industrial

Reliability of Metallized Ceramic Substrates for Power Electronics Applications

May 01, 2018 | Olivier Mathieu, Market Development Manager

As a design engineer for power electronics systems, you require the selected power module to fulfill its electrical function as described in its data sheet and you expect this module to be reliable meaning that it should operate under given conditions, in a defined period of time and within an acceptable failure rate.

Olivier's Twist Blog, Aerospace & Defense, Automotive & EV/HEV, General Industrial, Major Appliances, Rail, Wind & Solar

Designing Power Electronics for Latest Demands in Packaging and Assembly Technologies

Sep 25, 2017 | Rogers Corporation

Power electronics is changing rapidly. New packaging technologies are facing a rise in chip temperatures as seen in such applications as EVs / HEVs. Electronics increasingly need longer lifetimes to function in harsh conditions, such as wind turbines.

Automotive & EV/HEV, General Industrial

Rogers Corp. Broadens AquaPro® 37™ Polyurethane Materials for Sealing

Jun 07, 2017 | Rogers Corporation

Rogers Corporation announces an extension of the thickness range for AquaPro® 37™ – the material of choice for long-lasting protection of sensitive electronics and enclosed devices.

General Industrial