Our curamik Thermal substrates offer the best thermal conductivity in the industry. The substrates' AIN Direct Bond Copper (DBC) provides an adjusted thermal expansion coefficient, which is closer to that of silicon and results in little tension in the solder layer between chip and substrate. Our high-performance curamik Thermal material may be used in very high power density applications, such as train drives, wind turbines and industrial semiconductor modules.
|Description||Language||File Type||File Size|
|curamik Ceramic Substrates Product Information||English||
|curamik ceramic substrate solutions - High Power Density for Automotive Electrification||English||
|Technical Data Sheet curamik Ceramic Substrates||English||
|curamik® 陶瓷基板 技术数据表||中文||
View current applications of this product.