Rogers curamik Cooling Solutions offer a suite of advanced liquid cooling solutions powered by the state of the art curamik bonding process. curamik® cooling solutions, are setting the standard for liquid cooling in high-power applications. These innovative liquid coolers feature copper foil channel structures that are bonded into a tight block using the curamik process. We also offer the curamik® CoolEasy, a high precision machined copper cooler for passive laser diode cooling.
Benefits
Four times more efficient than traditional liquid cooling module structures
Layers hermetically combined without any additional soldering or adhesive
curamik CoolPower Plus coolers are integrated Direct Bond Copper (DBC) with ceramic substrates, enabling direct component assembly and electrical isolation from the cooling circuit
