Advanced Electronics Solutions

Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.

Anteo™ laminates provide dielectric constants (Dk) in alignment with FR-4 industry standards, simplifying the transition from existing FR-4 designs when superior electrical performance is required.

Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.

Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.

Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.

Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.

IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.

Kappa® 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates.

MAGTREX® 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.

Radix Printable Dielectric material is the first UV-curable 3D printing resin designed for RF applications.

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.

Rogers 2929 bondply is an unreinforced, thermoset based, thin film adhesive system.

• Dk or 2.32
• Ethylene-acrylic acid thermoplastic copolymer bonding film

• Dk of 2.35
• Chloro-trifluoroethylene (CTFE) thermoplastic copolymer bonding film

COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

• Prepreg family based on RO4000 series core materials.
• Sequential lamination capable
• Lead free soldering capable
• Thinner options for improved multilayer design flexibility

SpeedWave® 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.

• High precise machined copper cooler
• Capable of being diamond-milled for laser diode specifications
• Used with high power laser diodes in the 20-80W range

• High performance copper coolers for laser diode applications
• Cool laser diode bars up to 5 mm cavity length
• Can be used with high power laser diodes in the 20-100W range
• curamik CoolPerformance Plus reduces the CTE value to 5-6.5 ppm/K

• Copper liquid coolers for high power applications
• Layers hermetically combined without any additional soldering or adhesive
• curamik CoolPower Plus coolers are integrated Direct Bond Copper (DBC) with ceramic substrates, enabling direct component assembly and electrical isolation from the cooling circuit

• Based on Si₃N₄ ceramics and produced in Active Metal Brazed (AMB) process
• Used in applications where long lifetime, high power density and robustness are required
• Offers thermal conductivity of 90 W/m K @ 20°C
• Available in 6 thickness combinations
• CTE of 2.5 ppm/K @ 20°C - 300°C

• Al₂O₃ provides best price-performance ratio
• Offers sufficient thermal and mechanical properties for the most common applications
• Offers thermal conductivity of 24 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 6.8 ppm/K @ 20°C - 300°C

• HPS substrates provide enhanced robustness through Zr doped Al₂O₃ ceramics
• Used in medium power output applications
• Offers thermal conductivity of 26 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 7.1 ppm/K @ 20°C - 300°C

• Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
• Used in very high operational voltage and power density applications
• Offers thermal conductivity of 170 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 4.7 ppm/K @ 20°C - 300°C

• Available in multiple ceramic types, including Al₂O₃ , HPS (ZTA), AlN
• Enhanced reliability performance compared to material combinations of the same dimensions

• Unique soldering process mounts capacitors to ROLINX laminated busbars
• Produces small, lightweight assemblies with extremely low inductance and high power density
• Supports SiC technology

• Most optimal connection solution for high power distribution in very limited space
• Uses powder coating as outer insulation instead of insulation films, allowing for even greater compactness than a laminated busbar
• Easy and quick to install
• High power density capabilities and high temperature resistance

• Most cost-efficient, simplified busbar solution
• Designed to replace stacked busbars and simplify the supply chain

• Flexible busbar with pure copper laminates
• Offers flexibility for customized solutions
• Space saving, easy and quick bending
• Available in standard and customized length

• Combination of power and signal (logic) electronics on a single circuit
• One-piece busbar solution reduces installation time and eliminates wiring errors
• Simplifies the supply chain with a single-piece solution
• Features integrated connectors and surface mount components

• State-of-the-art laminated busbar technology for demanding, high power applications
• Provides optimized inductance and controls partial discharge
• Shaped to fit high voltage applications
• Compact design

• Combines the advantages of PCB and laminated busbar
• Meets the needs of low power applications with currents greater than 100 Amps
• Fit for high volume assembly processes and interconnection techniques
• Compact 3D design & wave soldering capability

• Enables existing power system design to be upgraded to a higher power level
• Extended temperature 130 deg. C range and humidity rating
• Allows for more power through the same copper section